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IFX24401
Low Dropout Voltage Regulator
IFX24401TEV50 IFX24401ELV50
Data Sheet
Rev. 1.02, 2009-12-10
Standard Power
Low Dropout Voltage Regulator
IFX24401
1
Features * * * * * * * * * * *
Overview
Output voltage 5 V 2% Ultra low current consumption: 20 A (typ.) 300 mA current capability Enable input Very low-drop voltage Short circuit protection Overtemperature protection Low Dropout Voltage, 250mV (typ.) High Input Voltage 45 V Temperature Range -40 C Tj 125 C Green Product (RoHS compliant)
PG-TO252-5
Applications * * * * * Battery powered devices (e.g. Handheld GPS) Portable Radios HDTV Televisions Game Consoles Network Routers PG-SSOP-14 For automotive and transportation applications, please refer to the Infineon TLE and TLF voltage regulator series. Functional Description The IFX24401 is a monolithic integrated low-drop voltage regulator for load currents up to 300 mA. The output voltage is regulated to VQ,nom = 5.0 V with an accuracy of 2%. A sophisticated design allows stable operation with low ESR ceramic output capacitors down to 470 nF. The device is designed for the harsh environments. Therefore it is protected against overload, short circuit and overtemperature conditions. Due to its ultra low stand-by current consumption of 20 A (typ.) the IFX24401 is ideal for use in battery powered applications. The regulator can be shut down via an Enable input which further reduces the current consumption to 5 A (typ.). An integrated output sink current circuitry keeps the voltage at the Output pin Q below 5.5 V even when reverse currents are applied. Thus connected devices are protected from overvoltage damage.
Type IFX24401TEV50 IFX24401ELV50 Data Sheet
Package PG-TO252-5 PG-SSOP-14 2
Marking 2440150 24401V50 Rev. 1.02, 2009-12-10
IFX24401
Block Diagram
2
Block Diagram
IFX24401
I
Overtemperature Shutdown Bandgap Reference
Q
1
EN
Enable
Charge Pump
GND
Figure 1
Block Diagram
Data Sheet
3
Rev. 1.02, 2009-12-10
IFX24401
Pin Configuration
3
Pin Configuration
I NC
Figure 2 Pin Configuration PG-TO252-5 (top view)
EN Q
3.1
Pin 1 2 3 4 5
Pin Definitions and Functions (PG-TO252-5 )
Symbol I N.C. GND EN Q Function Input Connect ceramic capcitor between I and GND No Connect May be open or connected to GND Ground Internally connected to heat slug Enable Input Low signal level disables the regulator. Pull-down resistor is integrated. Output Place capacitor between Q pin and GND. Capacitor placement should be close to pin. Refer to capacitance and ESR requirements in "Functional Range" on Page 6 Heat Slug Connect to board GND and heatsink
Heat Slug
--
Data Sheet
4
Rev. 1.02, 2009-12-10
IFX24401
Pin Configuration
Figure 3
Pin Configuration PG-SSOP-14 (top view)
3.2
Pin 1,2,3,5,7 4 6 8,10,11,1 2,14 9
Pin Definitions and Functions (PG-SSOP-14 )
Symbol N.C. GND EN N.C. Q Function No Connect May be open or connected to GND Ground Enable Input Low signal level disables the regulator. Pull-down resistor is integrated. No Connect May be open or connected to GND Output Place capacitor between Q pin and GND. Capacitor placement should be close to pin. Refer to capacitance and ESR requirements in "Functional Range" on Page 6 Input Connect ceramic capcitor between I and GND Exposed Pad Connect to board GND and heatsink
13 Pad
I
Data Sheet
5
Rev. 1.02, 2009-12-10
IFX24401
General Product Characteristics
4
4.1
General Product Characteristics
Absolute Maximum Ratings
Absolute Maximum Ratings1) Tj = -40 C to 150 C; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Input I Voltage Current Enable EN Voltage Current Output Q Voltage Voltage Current Temperature Junction temperature Storage temperature Symbol Limit Values Min. Max. 45 - 45 1 5.5 6.2 - 150 150 V mA V mA V V mA C C - - Observe current limit Unit Test Condition
VI II VEN IEN VQ VQ IQ Tj Tstg
-0.3 -1 -0.3 -1 -0.3 -0.3 -1 -40 -50
IEN,max2)
- -
t < 10 s3)
- - -
1) Not subject to production test, specified by design. 2) External resistor required to keep current below absolute maximum rating when voltages 5.5 V are applied. 3) Exposure to these absolute maximum ratings for extended periods (t > 10 s) may affect device reliability.
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation.
4.2
Parameter
Functional Range
Symbol Limit Values Min. Max. 42 125 - 10 V C nF - -
1)
Unit
Remarks
Input voltage Junction temperature Output Capacitor
VI Tj CQ
ESR (CQ)
5.5 -40 470 -
f = 10 kHz
1) The minimum output capacitance requirement is applicable for a worst case capacitor tolerance of 30%
Note: In the operating range, the functions given in the circuit description are fulfilled.
Data Sheet
6
Rev. 1.02, 2009-12-10
IFX24401
General Product Characteristics
4.3
Pos.
Thermal Resistance
Parameter Symbol Limit Value Min. Typ. 4 115 57 42 Max. - - - - K/W K/W K/W K/W measured to pin 5 Footprint only2) 300mm2 heatsink area on PCB2) 600mm2 heatsink area on PCB2) measured to pin 5 Footprint only2) 300mm2 heatsink area on PCB2) 600mm2 heatsink area on PCB2) Unit Conditions
IFX24401TEV50 (PG-TO252-5, ) 4.3.1 4.3.2 4.3.3 4.3.4 IFX24401ELV50 (PG-SSOP-14) 4.3.5 4.3.6 4.3.7 4.3.8
1) not subject to production test, specified by design 2) EIA/JESD 52_2, FR4, 80 x 80 x 1.5 mm; 35 Cu, 5 Sn
Junction to Case1) Junction to Ambient
1)
RthJC RthJA
- - - -
Junction to Case1) Junction to Ambient
1)
RthJC RthJA
- - - -
7 120 59 49
- - - -
K/W K/W K/W K/W
Data Sheet
7
Rev. 1.02, 2009-12-10
IFX24401
General Product Characteristics
Table 1 Parameter Output Q
Electrical Characteristics Symbol Limit Values Min. Typ. 5.0 5.0 - - 20 - 5 250 15 5 60 0.5 - - 3 0.5 Max. 5.1 5.1 - 800 30 40 9 500 40 20 - - - 0.8 4 1 V V mA mA A A A mV mV mV dB mV/K V V A A 0.1 mA < IQ < 300 mA; 6 V < VI < 16 V 0.1 mA < IQ < 100 mA; 6 V < VI < 40 V
1)
VI = 13.5 V; VEN = 5 V; -40 C < Tj < 125 C (unless otherwise specified)
Unit Measuring Condition
Output voltage Output voltage Output current limit Output current limit Current consumption; Iq = II - IQ Current consumption; Iq = II - IQ Quiescent current; Disabled Drop voltage Load regulation Line regulation Power supply ripple rejection Temperature output voltage drift Enable Input EN Turn-on Voltage Turn-off Voltage H-input current L-input current
VQ VQ IQ,LIM IQ,LIM Iq Iq Iq Vdr
VQ, lo VQ, li
4.9 4.9 320 - - - - - -40 -20 - - 3.1 - - -
PSRR
dVQ/dT
VQ = 0V IQ = 0.1 mA; Tj = 25 C IQ = 0.1 mA; Tj 80 C VEN = 0 V; Tj < 80 C IQ = 200 mA; Vdr = VI - VQ1) IQ = 5 mA to 250 mA Vl = 10V to 32 V; IQ = 5 mA fr = 100 Hz; Vr = 0.5 Vpp
- VQ 4.9 V VQ 0.3 V
VEN ON VEN OFF IEN ON IEN OFF
VEN = 5 V VEN = 0 V; Tj < 80 C
1) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V.
Data Sheet
8
Rev. 1.02, 2009-12-10
IFX24401
Typical Performance Characteristics
5
Typical Performance Characteristics
Current Consumption Iq versus Input Voltage VQ
1_Iq -Tj .v s d 3_IQ -V I.V S D
Current Consumption Iq versus Junction Temperature TJ
Iq [A ] VI = 13.5V
100
Iq [A]
T J = 25 C
IQ = 100 A
10
40
30
IQ = 50mA IQ = 10mA
20 1 10 I Q = 0.2mA
0.01 -40 -20
0
20
40 60
80 100 120 140
0
10
20
30
40
T J [C]
Current Consumption Iq versus Output Current IQ
30
2_IQ-IQ.VSD
VI [V ]
Output Voltage VQ versus Junction Temperature TJ
5A_VQ-TJ.VSD
Iq [A] Tj = 25 C
20
VI = 13.5 V
VQ [V]
VI = 13.5 V
Tj = -40 C
5.05
15
5.00
IQ =100A...100mA
10
4.95
5
4.90
0
20
40
60
100
-40 -20
0
20 40 60 80 100 120 140
IQ [mA]
Tj [C]
Data Sheet
9
Rev. 1.02, 2009-12-10
IFX24401
Typical Performance Characteristics
Dropout Voltage Vdr versus Output Current IQ
600
6_V DR-IQ .V S D
Maximum Output Current IQ versus Junction Temperature Tj
620
8_IQMA X -TJ . V S D
Vdr [mV ] T J = 150 C
IQ [mA ]
VI = 13.5 V
400
580
TJj = 25 C
300 560
200
TJ = -40 C
540
100
520
0
100
200
300
500 -40 -20
0
20
40 60
80 100 120 140
IQ [mA]
Dropout Voltage Vdr versus Junction Temperature
600
7_V DR-TJ . V S D
TJ [C]
Maximum Output Current IQ versus Input Voltage VI
600
9_S OA. V S D
IQ,L IM Vdr [mV]
[mA]
T j = 125 C T j = 25 C
400
IQ = 250 mA
400
300
300
IQ = 150mA
200 200
100
100
IQ = 10 mA
-40 -20 0 20 40 60 80 100 120 140 0 10 20 30 40
TJ [C]
VI [V]
Data Sheet
10
Rev. 1.02, 2009-12-10
IFX24401
Typical Performance Characteristics
Region of Stability
100
12_ESR-IQ.VSD
Output Voltage VQ Start-up behavior
14_V Itime _s tartup. v s d
ESRCQ
[]
CQ = 10nF ...10 F Tj = 25 C
VQ [V] EN = HIGH
10
5.05
IQ = 5mA
1 Stable Region 0.1
5.00
4.90
4.80
0.01
0
50
100
150
200
1
2
3
4
5
IQ [mA]
t [ms]
Load Regulation VQ versus Output Current Change IQ
0
18a_dV Q-dIQ _V i6V. vs d
Power Supply Ripple Rejection PSRR versus Frequency f
80
13_P S RR. V S D
PSRR
[dB ]
IQ = 0.1 mA I Q = 30 mA IQ = 100 mA
VQ
[mV ]
VI = 6V
60
-10
T j = -40 C Tj = 25 C
50
-15
40
-20
30
VRIPPLE = 0.5 V PP VI = 13 .5 V CQ = 10 F Tantalum TJ = 25 C
100 1k 10k 100 k
-25
T j = 150 C
10
-30
0
50
100
150
250
f [Hz]
IQ [mA]
Data Sheet
11
Rev. 1.02, 2009-12-10
IFX24401
Typical Performance Characteristics
Load Regulation VQ versus Output Current Change dIQ
0
18b_dV Q-dIQ_V i135V. vs d
Line Regulation VQ versus Input Voltage Changed VI
0
19_dV Q-dV I__150C. v sd
VQ
[mV ]
V I = 13 .5V
VQ
[mV ]
TJ = 150 C IQ = 1mA
IQ = 10 mA
IQ = 100 mA
-10
-2
T J = -40 C
-15 -3
-20
T J = 25 C
-4
-25
-5
T J = 150 C
-30 0 50 100 150 250 -6 0 5 10
IQ = 200mA
15 20 25 30 35 40 45
IQ [mA]
Load Regulation VQ versus Output Current Change IQ
0
18c _dV Q-dIQ_V i28V. vs d
VI [V]
Line Regulation VQ versus Input Voltage Changed VI
0
19_dV Q-dV I_25C. v sd
VQ
[mV ]
VI = 28
VQ
[mV ]
T J = 25 C
I Q = 1mA
-10
IQ = 10mA
-2
-15
T J = -40 C
-3
I Q = 100 mA
IQ = 200 mA
-20
-4
TJ = 25 C
-25
-5
T J = 150 C
-30 0 50 100 150 250
-6
0
5
10
15 20 25
30 35
40 45
IQ [mA]
VI [V]
Data Sheet
12
Rev. 1.02, 2009-12-10
IFX24401
Typical Performance Characteristics
Line Regulation VQ versus Input Voltage Change VI
0
19_dV Q-dV I_-40C. v sd
Load Transient Response Peak Voltage VQ
20_Load Tranc ient v s time 125. vs d
VQ
[mV ]
T J =40 C
IQ IQ =100mA
T J = 125 C V I = 13.5 V
IQ = 1mA
-2
IQ = 10 mA
-3
I Q = 100mA I Q = 200 mA
-4
VQ
-5
VQ = 100 mV/DIV
-6
t = 40 s/DIV
0
5
10
15 20 25
30 35
40 45
VI [V]
Load Transient Response Peak Voltage VQ Line Transient Response Peak Voltage VQ
20_Load Tranc ient v s time 25.v sd
21_Line Tranc ient v s time 25. vs d
IQ I Q = 100mA
T J = 25 C V I = 13.5 V
VI VI = 2V
T J = 25 C VI = 13.5 V
VQ
VQ = 50 mV/DIV
VQ
VQ = 100 mV/DIV
t = 40 s/DIV
t = 400 s/DIV
Data Sheet
13
Rev. 1.02, 2009-12-10
IFX24401
Typical Performance Characteristics
Line Transient Response Peak Voltage VQ
I
21_Line Tranc ient vs time 125. vs d
Enabled Input Current IEN versus Input Voltage VI , EN=Off
25_IINH v s V IN INH _off . v s d
VI VI = 2 V
T J = 125 C VI = 13.5 V
[A ] 1.0
IEN
EN = L (i.e. IC OFF)
0.8
T J = 150 C T J = 25 C TJ = -40C
0.6
VQ
VQ = 50 mV/DIV
0.4
0.2
t = 400 s/DIV
10
20
30
40
V I [V]
Enabled Input Current IEN versus Enabled Input Voltage VEN
24_IINH v s V INH. v s d
Thermal Resistance Junction-Ambient RTHJA versus Power Dissipation PV
75
32_RTH V S P V TO252.V S D
[A ] 50
IEN
T J = 150 C
RTH-JA
[K /W]
A = 300mm
2
Cooling Area single sided PCB
T J = 25C
40
65
T J = -40 C
30
60
20
TO252-5
55
10
50
10
20
30
40
3
6
9
12
V EN [V]
PV [W]
Data Sheet
14
Rev. 1.02, 2009-12-10
IFX24401
Application Information
6
Application Information
V Bat
100 nF IFX24401 1I Q5 470 nF + 4.7 F
V CC
Overtemperature Shutdown Bandgap Reference
1
e. g. Ignition
2 EN
Enable
Charge Pump GND 3, Tab
Figure 4
Application Diagram
Input, Output
An input capacitor is necessary for damping line influences. A resistor of approx. 1 in series with CI, can damp the LC of the input inductivity and the input capacitor. The IFX24401 requires a ceramic output capacitor of at least 470 nF. In order to damp influences resulting from load current surges it is recommended to add an additional electrolytic capacitor of 4.7 F to 47 F at the output as shown in Figure 4. Additionally a buffer capacitor CB of > 10F should be used for the output to suppress influences from load surges to the voltage levels. This one can either be an aluminum electrolytic capacitor or a tantalum capacitor following the application requirements. A general recommendation is to keep the drop over the equivalent serial resistor (ESR) together with the discharge of the blocking capacitor below the allowed Headroom of the Application to be supplied (e.g. typ. dVQ = 350mV). Since the regulator output current roughly rises linearly with time the discharge of the capacitor can be calculated as follows: dVCB = dIQ*dt/CB The drop across the ESR calculates as: dVESR = dI*ESR To prevent a reset the following relationship must be fullfilled: dVC + dVESR < VRH = 350mV Example: Assuming a load current change of dIQ = 100mA, a blocking capacitor of CB = 22F and a typical regulator reaction time under normal operating conditions of dt ~ 25s and for special dynamic load conditions, such as load step from very low base load, a reaction time of dt ~ 75s. dVC = dIQ*dt/CB = 100mA * 25s/22F = 113mV So for the ESR we can allow dVESR = VRH2 - dVC = 350mV - 113mV = 236mV The permissible ESR becomes: ESR = dVESR / dIQ = 236mV/100mA = 2.36Ohm Data Sheet 15 Rev. 1.02, 2009-12-10
IFX24401
Package Outlines
7
Package Outlines
6.5 +0.15 -0.05 5.7 MAX.
(4.24) 1 0.1
1)
A B
0.8 0.15
2.3 +0.05 -0.10 0.5 +0.08 -0.04
(5)
9.98 0.5 6.22 -0.2
0.9 +0.20 -0.01 0...0.15
0.51 MIN.
0.15 MAX. per side
5 x 0.6 0.1 1.14
0.5 +0.08 -0.04 0.1 B
4.56
0.25 M A B
GPT09527
1) Includes mold flashes on each side. All metal surfaces tin plated, except area of cut.
Figure 5 PG-TO252-5
0.35 x 45
Stand Off (1.45)
1.7 MAX.
3.9 0.11)
0.1 C D
0 ... 0.1
0.19 +0.06
0.08 C 6 0.2
0.65 0.25 0.05 2)
C
0.64 0.25
D 0.2
8 MAX.
M
0.15 M C A-B D 14x
D 8x
A
14 8
Bottom View 3 0.2
1 7
1
7
B 0.1 C A-B 2x
Exposed Diepad
14
8
4.9 0.11)
Index Marking
GPT09113
1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Does not include dambar protrusion
PG-SSOP-14-1,-2,-3-PO V02
Figure 6
PG-SSOP-14
Data Sheet
16
2.65 0.2
Rev. 1.02, 2009-12-10
IFX24401
Revision History
8
Revision
Revision History
Date Changes
1.02 1.01 1.0
2009-12-10 2009-10-19 2009-04-28
Corrections to pin assignment Coverpage changed Overview page: Inserted reference statement to TLE/TLF series. Initial Release
Data Sheet
17
Rev. 1.02, 2009-12-10
Edition 2009-12-10 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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